High K Low Loss Dielectrics Co-Fireable with LTCC
Rapid growth in the application of LTCC technology for RF wireless is clearly driven by the trend of miniaturization and mobile communication systems. This technology provides the possibility of integration of passive components in a cost effective way. Heraeus has implemented compatible high permit...
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2002-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1080/08827510212346 |
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| _version_ | 1832549493198815232 |
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| author | Christina Modes Stefan Malkmus Frieder Gora |
| author_facet | Christina Modes Stefan Malkmus Frieder Gora |
| author_sort | Christina Modes |
| collection | DOAJ |
| description | Rapid growth in the application of LTCC technology for RF wireless is clearly driven by the trend of miniaturization and mobile communication systems. This technology provides the possibility of integration of passive components in a cost effective way. Heraeus has implemented compatible high permitivity and low loss dielectrics with NPO performance into modified Heraeus CT700 low temperature co-fired ceramic tape system. The majority of
commercially available microwave dielectrics show increasing firing temperatures >200 °C
which make them incompatible with Ag metallizations or show high dielectric loss which limit their usage in RF wireless applications. This development work demonstrates the integration of a low loss, high permittivity ε=60
dielectric tape into a conventional Ag bearing LTCC structure. The concept of a dual sintering process is introduced and the resultant mechanical benefits with regard to tape fired shrinkage are explained in detail. Permittivity and dielectric loss data at RF for the new structure are presented. These high K and low loss dielectrics along with a comprehensive material system developed by Heraeus will support customers in meeting the challenges of
reducing cost and enhancing the performance of RF devices for high frequency applications. |
| format | Article |
| id | doaj-art-226791b24a61429f91ebeb6a222a587b |
| institution | Kabale University |
| issn | 0882-7516 1563-5031 |
| language | English |
| publishDate | 2002-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Active and Passive Electronic Components |
| spelling | doaj-art-226791b24a61429f91ebeb6a222a587b2025-02-03T06:11:11ZengWileyActive and Passive Electronic Components0882-75161563-50312002-01-0125214114510.1080/08827510212346High K Low Loss Dielectrics Co-Fireable with LTCCChristina Modes0Stefan Malkmus1Frieder Gora2W.C. Heraeus GmbH & Co KG, Circuit Materials, 12-14 Heraeusstrasse, Hanau D-63450, GermanyQuentin Reynolds, Heraeus Materials Ltd, Canada Road, Byfleet, Surrey KT14 7JL, Wolfram Wersing, Oliver Dernovsek, Siemens AG, CT MM2, 6 Otto-Hahn-Ring, Munich D-81730, GermanyWolfgang Schiller, Bundesanstalt für Materialforschung und -prüfung, BAM-V.4 44-46 Unter den Eichen, Berlin D-12203, GermanyRapid growth in the application of LTCC technology for RF wireless is clearly driven by the trend of miniaturization and mobile communication systems. This technology provides the possibility of integration of passive components in a cost effective way. Heraeus has implemented compatible high permitivity and low loss dielectrics with NPO performance into modified Heraeus CT700 low temperature co-fired ceramic tape system. The majority of commercially available microwave dielectrics show increasing firing temperatures >200 °C which make them incompatible with Ag metallizations or show high dielectric loss which limit their usage in RF wireless applications. This development work demonstrates the integration of a low loss, high permittivity ε=60 dielectric tape into a conventional Ag bearing LTCC structure. The concept of a dual sintering process is introduced and the resultant mechanical benefits with regard to tape fired shrinkage are explained in detail. Permittivity and dielectric loss data at RF for the new structure are presented. These high K and low loss dielectrics along with a comprehensive material system developed by Heraeus will support customers in meeting the challenges of reducing cost and enhancing the performance of RF devices for high frequency applications.http://dx.doi.org/10.1080/08827510212346 |
| spellingShingle | Christina Modes Stefan Malkmus Frieder Gora High K Low Loss Dielectrics Co-Fireable with LTCC Active and Passive Electronic Components |
| title | High K Low Loss Dielectrics Co-Fireable with LTCC |
| title_full | High K Low Loss Dielectrics Co-Fireable with LTCC |
| title_fullStr | High K Low Loss Dielectrics Co-Fireable with LTCC |
| title_full_unstemmed | High K Low Loss Dielectrics Co-Fireable with LTCC |
| title_short | High K Low Loss Dielectrics Co-Fireable with LTCC |
| title_sort | high k low loss dielectrics co fireable with ltcc |
| url | http://dx.doi.org/10.1080/08827510212346 |
| work_keys_str_mv | AT christinamodes highklowlossdielectricscofireablewithltcc AT stefanmalkmus highklowlossdielectricscofireablewithltcc AT friedergora highklowlossdielectricscofireablewithltcc |