Improvement of bonding behavior of cold-rolled stainless steel/copper composite plates via surface spinel structure treatment
Because the deformation coordination between stainless steel and copper is poor, it is difficult to prepare stainless steel/copper composite plates using cold roll bonding (CRB). Therefore, this study proposes a surface spinelization cold rolling process for preparing stainless steel/copper composit...
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Elsevier
2025-03-01
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author | Bowei Wang Baojun You Yuting Hu Lun Fu Chao Yu Hong Xiao |
author_facet | Bowei Wang Baojun You Yuting Hu Lun Fu Chao Yu Hong Xiao |
author_sort | Bowei Wang |
collection | DOAJ |
description | Because the deformation coordination between stainless steel and copper is poor, it is difficult to prepare stainless steel/copper composite plates using cold roll bonding (CRB). Therefore, this study proposes a surface spinelization cold rolling process for preparing stainless steel/copper composite plates. The pre-oxidation treatment before CRB spinelized the stainless steel surface, and a solid mechanical occlusion was formed at the bonding interface after rolling. The reduction rate of the composite plates prepared via CRB was reduced, and stainless steel/copper composite plates with optimal bonding performance were obtained. The mechanical properties and microstructures of the rolled composite plates under the two surface treatment methods were compared via steel wire brush grinding and oxidation treatments on stainless steel surfaces. The results showed that the minimum reduction rate of the steel-wire brush grinding treatment was 60% and that the shear strength was 84.48 MPa. Under the surface oxidation treatment process, the two metals were bonded at a 45% reduction rate with a shear strength of 27.35 MPa. Additionally, the shear strength of the composite plates can achieve 94.82 MPa at a 60% reduction rate. The mechanism analysis shows that there are defects between the work-hardening layer and stainless-steel matrix. Moreover, the cracks generated during the rolling process are smaller, which is not conducive to the formation of mechanical occlusion. The cracks in the spinelized hardened layer prepared via the oxidation treatment were larger during rolling, and the bonding interface easily formed a strong mechanical occlusion. |
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institution | Kabale University |
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language | English |
publishDate | 2025-03-01 |
publisher | Elsevier |
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spelling | doaj-art-1f18aa8c3f154fb8a7a5ea25962344992025-01-24T04:45:17ZengElsevierJournal of Materials Research and Technology2238-78542025-03-013515861595Improvement of bonding behavior of cold-rolled stainless steel/copper composite plates via surface spinel structure treatmentBowei Wang0Baojun You1Yuting Hu2Lun Fu3Chao Yu4Hong Xiao5National Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao, 066004, Hebei, China; College of Mechanical Engineering, Yanshan University, Qinhuangdao, Hebei, 066004, ChinaNational Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao, 066004, Hebei, China; College of Mechanical Engineering, Yanshan University, Qinhuangdao, Hebei, 066004, ChinaNational Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao, 066004, Hebei, China; College of Mechanical Engineering, Yanshan University, Qinhuangdao, Hebei, 066004, ChinaNational Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao, 066004, Hebei, China; College of Mechanical Engineering, Yanshan University, Qinhuangdao, Hebei, 066004, China; Corresponding author. National Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao, 066004, Hebei, China.National Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao, 066004, Hebei, China; College of Mechanical Engineering, Yanshan University, Qinhuangdao, Hebei, 066004, China; Corresponding author. College of Mechanical Engineering, Yanshan University, Qinhuangdao, Hebei, 066004, China.National Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao, 066004, Hebei, China; College of Mechanical Engineering, Yanshan University, Qinhuangdao, Hebei, 066004, ChinaBecause the deformation coordination between stainless steel and copper is poor, it is difficult to prepare stainless steel/copper composite plates using cold roll bonding (CRB). Therefore, this study proposes a surface spinelization cold rolling process for preparing stainless steel/copper composite plates. The pre-oxidation treatment before CRB spinelized the stainless steel surface, and a solid mechanical occlusion was formed at the bonding interface after rolling. The reduction rate of the composite plates prepared via CRB was reduced, and stainless steel/copper composite plates with optimal bonding performance were obtained. The mechanical properties and microstructures of the rolled composite plates under the two surface treatment methods were compared via steel wire brush grinding and oxidation treatments on stainless steel surfaces. The results showed that the minimum reduction rate of the steel-wire brush grinding treatment was 60% and that the shear strength was 84.48 MPa. Under the surface oxidation treatment process, the two metals were bonded at a 45% reduction rate with a shear strength of 27.35 MPa. Additionally, the shear strength of the composite plates can achieve 94.82 MPa at a 60% reduction rate. The mechanism analysis shows that there are defects between the work-hardening layer and stainless-steel matrix. Moreover, the cracks generated during the rolling process are smaller, which is not conducive to the formation of mechanical occlusion. The cracks in the spinelized hardened layer prepared via the oxidation treatment were larger during rolling, and the bonding interface easily formed a strong mechanical occlusion.http://www.sciencedirect.com/science/article/pii/S2238785425001176Stainless steel/copper composite platesCold roll bondingSpinel structure treatment |
spellingShingle | Bowei Wang Baojun You Yuting Hu Lun Fu Chao Yu Hong Xiao Improvement of bonding behavior of cold-rolled stainless steel/copper composite plates via surface spinel structure treatment Journal of Materials Research and Technology Stainless steel/copper composite plates Cold roll bonding Spinel structure treatment |
title | Improvement of bonding behavior of cold-rolled stainless steel/copper composite plates via surface spinel structure treatment |
title_full | Improvement of bonding behavior of cold-rolled stainless steel/copper composite plates via surface spinel structure treatment |
title_fullStr | Improvement of bonding behavior of cold-rolled stainless steel/copper composite plates via surface spinel structure treatment |
title_full_unstemmed | Improvement of bonding behavior of cold-rolled stainless steel/copper composite plates via surface spinel structure treatment |
title_short | Improvement of bonding behavior of cold-rolled stainless steel/copper composite plates via surface spinel structure treatment |
title_sort | improvement of bonding behavior of cold rolled stainless steel copper composite plates via surface spinel structure treatment |
topic | Stainless steel/copper composite plates Cold roll bonding Spinel structure treatment |
url | http://www.sciencedirect.com/science/article/pii/S2238785425001176 |
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