Wang, B., You, B., Hu, Y., Fu, L., Yu, C., & Xiao, H. Improvement of bonding behavior of cold-rolled stainless steel/copper composite plates via surface spinel structure treatment. Elsevier.
Chicago Style (17th ed.) CitationWang, Bowei, Baojun You, Yuting Hu, Lun Fu, Chao Yu, and Hong Xiao. Improvement of Bonding Behavior of Cold-rolled Stainless Steel/copper Composite Plates via Surface Spinel Structure Treatment. Elsevier.
MLA (9th ed.) CitationWang, Bowei, et al. Improvement of Bonding Behavior of Cold-rolled Stainless Steel/copper Composite Plates via Surface Spinel Structure Treatment. Elsevier.
Warning: These citations may not always be 100% accurate.