Reliability Analysis of Bond Buffer Technologies for Wide Bandgap Power Devices
Wide bandgap power devices with excellent performance over traditional silicon power devices have been introduced as the prime candidate for power electronics applications. However, interconnections on the chip topside in the traditional packaging are now limiting the lifetime of wide bandgap power...
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| Main Authors: | , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2021-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.004 |
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