Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging
Semiconductor integrated circuit (IC) chips are regularly exposed to physical attacks and faced to the compromise of information security. An attacker leverages Si substrate backside as the open surface of an IC chip in flip-chip packaging and explores the points of information leakage over the enti...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Open Journal of the Solid-State Circuits Society |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10755152/ |
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