Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging
Semiconductor integrated circuit (IC) chips are regularly exposed to physical attacks and faced to the compromise of information security. An attacker leverages Si substrate backside as the open surface of an IC chip in flip-chip packaging and explores the points of information leakage over the enti...
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| Format: | Article |
| Language: | English |
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IEEE
2024-01-01
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| Series: | IEEE Open Journal of the Solid-State Circuits Society |
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| Online Access: | https://ieeexplore.ieee.org/document/10755152/ |
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| author | Makoto Nagata Takuji Miki |
| author_facet | Makoto Nagata Takuji Miki |
| author_sort | Makoto Nagata |
| collection | DOAJ |
| description | Semiconductor integrated circuit (IC) chips are regularly exposed to physical attacks and faced to the compromise of information security. An attacker leverages Si substrate backside as the open surface of an IC chip in flip-chip packaging and explores the points of information leakage over the entire backside without being hampered by physical obstacles as well as applying invasive treatments. Physical side channels (SCs), e.g., voltage potentials, current flows, electromagnetic (EM) waves, and photons, are transparent through Si substrate and attributed to the operation of security ICs. An attacker measures SCs using probes as well as antennas and correlates them with secret information, such as secret key bytes, used in a cryptographic processor or analog quantities at the frontend of Internet of Things (IoT) gadgets. This article defines and elucidates the emerging threats of Si-substrate backside attacks on flipped IC chips, demonstrates attacks and proposes countermeasures. |
| format | Article |
| id | doaj-art-1a1a1a93e545464cabd5ffd26e1b2611 |
| institution | Kabale University |
| issn | 2644-1349 |
| language | English |
| publishDate | 2024-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Open Journal of the Solid-State Circuits Society |
| spelling | doaj-art-1a1a1a93e545464cabd5ffd26e1b26112025-01-25T00:03:11ZengIEEEIEEE Open Journal of the Solid-State Circuits Society2644-13492024-01-01436537510.1109/OJSSCS.2024.349996710755152Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip PackagingMakoto Nagata0https://orcid.org/0000-0002-0625-9107Takuji Miki1https://orcid.org/0000-0002-0168-3304The Graduate School of Science, Technology and Innovation, Kobe University, Kobe, JapanThe Graduate School of Science, Technology and Innovation, Kobe University, Kobe, JapanSemiconductor integrated circuit (IC) chips are regularly exposed to physical attacks and faced to the compromise of information security. An attacker leverages Si substrate backside as the open surface of an IC chip in flip-chip packaging and explores the points of information leakage over the entire backside without being hampered by physical obstacles as well as applying invasive treatments. Physical side channels (SCs), e.g., voltage potentials, current flows, electromagnetic (EM) waves, and photons, are transparent through Si substrate and attributed to the operation of security ICs. An attacker measures SCs using probes as well as antennas and correlates them with secret information, such as secret key bytes, used in a cryptographic processor or analog quantities at the frontend of Internet of Things (IoT) gadgets. This article defines and elucidates the emerging threats of Si-substrate backside attacks on flipped IC chips, demonstrates attacks and proposes countermeasures.https://ieeexplore.ieee.org/document/10755152/Advanced packagingcryptographyhardware securityintegrated circuits (ICs)secure packagingside channel (SC) attack |
| spellingShingle | Makoto Nagata Takuji Miki Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging IEEE Open Journal of the Solid-State Circuits Society Advanced packaging cryptography hardware security integrated circuits (ICs) secure packaging side channel (SC) attack |
| title | Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging |
| title_full | Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging |
| title_fullStr | Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging |
| title_full_unstemmed | Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging |
| title_short | Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging |
| title_sort | si substrate backside x2014 an emerging physical attack surface for secure ics in flip chip packaging |
| topic | Advanced packaging cryptography hardware security integrated circuits (ICs) secure packaging side channel (SC) attack |
| url | https://ieeexplore.ieee.org/document/10755152/ |
| work_keys_str_mv | AT makotonagata sisubstratebacksidex2014anemergingphysicalattacksurfaceforsecureicsinflipchippackaging AT takujimiki sisubstratebacksidex2014anemergingphysicalattacksurfaceforsecureicsinflipchippackaging |