APA (7th ed.) Citation

Nagata, M., & Miki, T. Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging. IEEE.

Chicago Style (17th ed.) Citation

Nagata, Makoto, and Takuji Miki. Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging. IEEE.

MLA (9th ed.) Citation

Nagata, Makoto, and Takuji Miki. Si Substrate Backside—An Emerging Physical Attack Surface for Secure ICs in Flip Chip Packaging. IEEE.

Warning: These citations may not always be 100% accurate.