Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies

Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies

Thin-film assemblies containing an adhesion layer (AdL) or a release layer (RL) with nanoscale thickness are widely used in semiconductors, electrical circuit boards, optical and optoelectronic devices, photodiodes, and photonics applications. Current environmental concerns and technological demands...

Full description

Saved in:
Bibliographic Details
Main Authors: Frédéric Addiego, Rutuja Bhusari, Julien Bardon, Sascha Scholzen, Zainhia Kaidi
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Series:Nanomaterials
Subjects:
material assembly
adhesive
release layer
nanoscale
structure
characterization
Online Access:https://www.mdpi.com/2079-4991/15/11/840
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items

Similar Items