Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies

Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies

Thin-film assemblies containing an adhesion layer (AdL) or a release layer (RL) with nanoscale thickness are widely used in semiconductors, electrical circuit boards, optical and optoelectronic devices, photodiodes, and photonics applications. Current environmental concerns and technological demands...

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Bibliographic Details
Main Authors: Frédéric Addiego, Rutuja Bhusari, Julien Bardon, Sascha Scholzen, Zainhia Kaidi
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Series:Nanomaterials
Subjects:
material assembly
adhesive
release layer
nanoscale
structure
characterization
Online Access:https://www.mdpi.com/2079-4991/15/11/840
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