Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies
Thin-film assemblies containing an adhesion layer (AdL) or a release layer (RL) with nanoscale thickness are widely used in semiconductors, electrical circuit boards, optical and optoelectronic devices, photodiodes, and photonics applications. Current environmental concerns and technological demands...
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MDPI AG
2025-05-01
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| Series: | Nanomaterials |
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| author | Frédéric Addiego Rutuja Bhusari Julien Bardon Sascha Scholzen Zainhia Kaidi |
| author_facet | Frédéric Addiego Rutuja Bhusari Julien Bardon Sascha Scholzen Zainhia Kaidi |
| author_sort | Frédéric Addiego |
| collection | DOAJ |
| description | Thin-film assemblies containing an adhesion layer (AdL) or a release layer (RL) with nanoscale thickness are widely used in semiconductors, electrical circuit boards, optical and optoelectronic devices, photodiodes, and photonics applications. Current environmental concerns and technological demands necessitate continuous advancements in these nano-AdLs and nano-RLs in terms of formulation, design, functionality, and durability. Developing these nano-layers relies on understanding their structural properties, which is challenging because only characterization tools with nanoscale or sub-nanoscale lateral resolution can be employed. The aim of this review is to provide an overview of the current techniques and methods available for characterizing the structural properties of nano-layers in cross-section. Emphasis is placed on sample preparation methods, the fundamental principles, advantages, and limitations of various techniques, and examples from the existing literature. First, selecting the appropriate characterization technique depends on the required lateral resolution—it must be finer than the size of the structural feature of interest. A high lateral resolution relative to this structural feature translates to more accurate characterization, enabling effective profiling and mapping analysis. Subsequently, it is important to optimize sample preparation regarding shape, dimensions, and surface roughness, while minimizing artifacts. Combining techniques that offer complementary structural information—such as morphological, chemical, and nanomechanical data—is recommended to gain a comprehensive understanding of the nano-layer’s structure and properties. This is especially important when utilizing 3D characterization methods. It is worth noting that few examples of cross-sectional analysis for nano-AdLs and nano-RLs are available in the literature, highlighting the need for further nanoscale investigations. This review aims to serve as a practical guide for scientists, helping them identify suitable characterization procedures based on the specific structural information they seek to obtain. |
| format | Article |
| id | doaj-art-151dbe1764b34dfd896f2d9de0c2fc55 |
| institution | OA Journals |
| issn | 2079-4991 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Nanomaterials |
| spelling | doaj-art-151dbe1764b34dfd896f2d9de0c2fc552025-08-20T02:22:58ZengMDPI AGNanomaterials2079-49912025-05-01151184010.3390/nano15110840Nanoscale Cross-Sectional Characterization of Thin Layers in Material AssembliesFrédéric Addiego0Rutuja Bhusari1Julien Bardon2Sascha Scholzen3Zainhia Kaidi4Structural Composites Unit, Luxembourg Institute of Science and Technology, 5 Avenue des Hauts-Fourneaux, L-4362 Esch-Belval Esch-sur-Alzette, LuxembourgStructural Composites Unit, Luxembourg Institute of Science and Technology, 5 Avenue des Hauts-Fourneaux, L-4362 Esch-Belval Esch-sur-Alzette, LuxembourgStructural Composites Unit, Luxembourg Institute of Science and Technology, 5 Avenue des Hauts-Fourneaux, L-4362 Esch-Belval Esch-sur-Alzette, LuxembourgCircuit Foil Luxembourg, 6 Salzbaach, L-9559 Wiltz, LuxembourgCircuit Foil Luxembourg, 6 Salzbaach, L-9559 Wiltz, LuxembourgThin-film assemblies containing an adhesion layer (AdL) or a release layer (RL) with nanoscale thickness are widely used in semiconductors, electrical circuit boards, optical and optoelectronic devices, photodiodes, and photonics applications. Current environmental concerns and technological demands necessitate continuous advancements in these nano-AdLs and nano-RLs in terms of formulation, design, functionality, and durability. Developing these nano-layers relies on understanding their structural properties, which is challenging because only characterization tools with nanoscale or sub-nanoscale lateral resolution can be employed. The aim of this review is to provide an overview of the current techniques and methods available for characterizing the structural properties of nano-layers in cross-section. Emphasis is placed on sample preparation methods, the fundamental principles, advantages, and limitations of various techniques, and examples from the existing literature. First, selecting the appropriate characterization technique depends on the required lateral resolution—it must be finer than the size of the structural feature of interest. A high lateral resolution relative to this structural feature translates to more accurate characterization, enabling effective profiling and mapping analysis. Subsequently, it is important to optimize sample preparation regarding shape, dimensions, and surface roughness, while minimizing artifacts. Combining techniques that offer complementary structural information—such as morphological, chemical, and nanomechanical data—is recommended to gain a comprehensive understanding of the nano-layer’s structure and properties. This is especially important when utilizing 3D characterization methods. It is worth noting that few examples of cross-sectional analysis for nano-AdLs and nano-RLs are available in the literature, highlighting the need for further nanoscale investigations. This review aims to serve as a practical guide for scientists, helping them identify suitable characterization procedures based on the specific structural information they seek to obtain.https://www.mdpi.com/2079-4991/15/11/840material assemblyadhesiverelease layernanoscalestructurecharacterization |
| spellingShingle | Frédéric Addiego Rutuja Bhusari Julien Bardon Sascha Scholzen Zainhia Kaidi Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies Nanomaterials material assembly adhesive release layer nanoscale structure characterization |
| title | Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies |
| title_full | Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies |
| title_fullStr | Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies |
| title_full_unstemmed | Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies |
| title_short | Nanoscale Cross-Sectional Characterization of Thin Layers in Material Assemblies |
| title_sort | nanoscale cross sectional characterization of thin layers in material assemblies |
| topic | material assembly adhesive release layer nanoscale structure characterization |
| url | https://www.mdpi.com/2079-4991/15/11/840 |
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