Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
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Main Authors: | R. Kato, Y. Hiki, T. Tsuge, M. Nitta |
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Format: | Article |
Language: | English |
Published: |
Wiley
1981-01-01
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Series: | Active and Passive Electronic Components |
Online Access: | http://dx.doi.org/10.1155/APEC.8.27 |
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