Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
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Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
Wiley
1981-01-01
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Series: | Active and Passive Electronic Components |
Online Access: | http://dx.doi.org/10.1155/APEC.8.27 |
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_version_ | 1832560995975823360 |
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author | R. Kato Y. Hiki T. Tsuge M. Nitta |
author_facet | R. Kato Y. Hiki T. Tsuge M. Nitta |
author_sort | R. Kato |
collection | DOAJ |
format | Article |
id | doaj-art-14b31627889943649497ef7573230a91 |
institution | Kabale University |
issn | 0882-7516 1563-5031 |
language | English |
publishDate | 1981-01-01 |
publisher | Wiley |
record_format | Article |
series | Active and Passive Electronic Components |
spelling | doaj-art-14b31627889943649497ef7573230a912025-02-03T01:26:14ZengWileyActive and Passive Electronic Components0882-75161563-50311981-01-0181-2273610.1155/APEC.8.27Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer LeadsR. KatoY. HikiT. TsugeM. Nittahttp://dx.doi.org/10.1155/APEC.8.27 |
spellingShingle | R. Kato Y. Hiki T. Tsuge M. Nitta Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads Active and Passive Electronic Components |
title | Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads |
title_full | Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads |
title_fullStr | Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads |
title_full_unstemmed | Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads |
title_short | Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads |
title_sort | process and accelerated aging test of gang bonding for gold plated tab outer leads |
url | http://dx.doi.org/10.1155/APEC.8.27 |
work_keys_str_mv | AT rkato processandacceleratedagingtestofgangbondingforgoldplatedtabouterleads AT yhiki processandacceleratedagingtestofgangbondingforgoldplatedtabouterleads AT ttsuge processandacceleratedagingtestofgangbondingforgoldplatedtabouterleads AT mnitta processandacceleratedagingtestofgangbondingforgoldplatedtabouterleads |