Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads

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Bibliographic Details
Main Authors: R. Kato, Y. Hiki, T. Tsuge, M. Nitta
Format: Article
Language:English
Published: Wiley 1981-01-01
Series:Active and Passive Electronic Components
Online Access:http://dx.doi.org/10.1155/APEC.8.27
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author R. Kato
Y. Hiki
T. Tsuge
M. Nitta
author_facet R. Kato
Y. Hiki
T. Tsuge
M. Nitta
author_sort R. Kato
collection DOAJ
format Article
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institution Kabale University
issn 0882-7516
1563-5031
language English
publishDate 1981-01-01
publisher Wiley
record_format Article
series Active and Passive Electronic Components
spelling doaj-art-14b31627889943649497ef7573230a912025-02-03T01:26:14ZengWileyActive and Passive Electronic Components0882-75161563-50311981-01-0181-2273610.1155/APEC.8.27Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer LeadsR. KatoY. HikiT. TsugeM. Nittahttp://dx.doi.org/10.1155/APEC.8.27
spellingShingle R. Kato
Y. Hiki
T. Tsuge
M. Nitta
Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
Active and Passive Electronic Components
title Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
title_full Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
title_fullStr Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
title_full_unstemmed Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
title_short Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
title_sort process and accelerated aging test of gang bonding for gold plated tab outer leads
url http://dx.doi.org/10.1155/APEC.8.27
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AT yhiki processandacceleratedagingtestofgangbondingforgoldplatedtabouterleads
AT ttsuge processandacceleratedagingtestofgangbondingforgoldplatedtabouterleads
AT mnitta processandacceleratedagingtestofgangbondingforgoldplatedtabouterleads