Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials
In foil has excellent heat dissipation performance as a commercially available thermal interface material for high power devices. In order to improve the heat transfer performance of In-based thermal interface materials, a composite thermal interface material with In as the matrix and Cu as the rein...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-01-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424029077 |
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| author | Jie Zhang Nan Wu Hong Guo Zhongnan Xie Mingmei Sun Hui Yang Ximin Zhang Yulin Liu Xinbo He |
| author_facet | Jie Zhang Nan Wu Hong Guo Zhongnan Xie Mingmei Sun Hui Yang Ximin Zhang Yulin Liu Xinbo He |
| author_sort | Jie Zhang |
| collection | DOAJ |
| description | In foil has excellent heat dissipation performance as a commercially available thermal interface material for high power devices. In order to improve the heat transfer performance of In-based thermal interface materials, a composite thermal interface material with In as the matrix and Cu as the reinforcement was prepared in this research by hot press sintering. The Cu–In composite material's characteristic interfacial structure was examined through the use of transmission electron microscopy. Theoretical models were employed to determine the thermal conduction patterns across various CuIn phase interfaces. By fine-tuning the parameters of the hot press sintering process, we were able to regulate the CuIn phase interface layer's morphology. Results indicate that the Cu–In interface is bonded through a reactive interface, leading to the formation of the CuIn phase that is tightly atomically bonded with both In and Cu. The CuIn phase, when continuous, exhibits higher interfacial thermal conductivity as its thickness decreases. Practical fabrication considerations show that the CuIn phase interface transitions from discontinuous to continuous at a thickness of ∼0.91 μm. Therefore, a continuous CuIn phase interface layer of about 0.91 μm thick yields the highest thermal conductivity, reaching 122.25 Wm−1K−1, which is 1.4 times greater than that of pure In. This research presents innovative choices and strategic directions for advancing the field of high-thermal-conductivity interfacial materials. |
| format | Article |
| id | doaj-art-13fbed25f84a44f3a9e51019dfc81f7b |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-13fbed25f84a44f3a9e51019dfc81f7b2025-01-19T06:25:28ZengElsevierJournal of Materials Research and Technology2238-78542025-01-013410201028Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materialsJie Zhang0Nan Wu1Hong Guo2Zhongnan Xie3Mingmei Sun4Hui Yang5Ximin Zhang6Yulin Liu7Xinbo He8State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China; Institute for Advanced Materials and Technology, University of Science and Technology, Beijing 100083, China; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China; General Research Institute for Nonferrous Metals, Beijing 100088, ChinaState Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China; General Research Institute for Nonferrous Metals, Beijing 100088, ChinaState Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China; Corresponding author. GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China.State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, ChinaState Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, ChinaState Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, ChinaState Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, ChinaState Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China; GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China; General Research Institute for Nonferrous Metals, Beijing 100088, ChinaInstitute for Advanced Materials and Technology, University of Science and Technology, Beijing 100083, ChinaIn foil has excellent heat dissipation performance as a commercially available thermal interface material for high power devices. In order to improve the heat transfer performance of In-based thermal interface materials, a composite thermal interface material with In as the matrix and Cu as the reinforcement was prepared in this research by hot press sintering. The Cu–In composite material's characteristic interfacial structure was examined through the use of transmission electron microscopy. Theoretical models were employed to determine the thermal conduction patterns across various CuIn phase interfaces. By fine-tuning the parameters of the hot press sintering process, we were able to regulate the CuIn phase interface layer's morphology. Results indicate that the Cu–In interface is bonded through a reactive interface, leading to the formation of the CuIn phase that is tightly atomically bonded with both In and Cu. The CuIn phase, when continuous, exhibits higher interfacial thermal conductivity as its thickness decreases. Practical fabrication considerations show that the CuIn phase interface transitions from discontinuous to continuous at a thickness of ∼0.91 μm. Therefore, a continuous CuIn phase interface layer of about 0.91 μm thick yields the highest thermal conductivity, reaching 122.25 Wm−1K−1, which is 1.4 times greater than that of pure In. This research presents innovative choices and strategic directions for advancing the field of high-thermal-conductivity interfacial materials.http://www.sciencedirect.com/science/article/pii/S2238785424029077Thermal interface materialCu–In composite materialsHot press sinteringInterface regulationThermal conductivity |
| spellingShingle | Jie Zhang Nan Wu Hong Guo Zhongnan Xie Mingmei Sun Hui Yang Ximin Zhang Yulin Liu Xinbo He Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials Journal of Materials Research and Technology Thermal interface material Cu–In composite materials Hot press sintering Interface regulation Thermal conductivity |
| title | Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials |
| title_full | Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials |
| title_fullStr | Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials |
| title_full_unstemmed | Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials |
| title_short | Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials |
| title_sort | study on interface structure and thermal conductivity regulation of cu in composite thermal interface materials |
| topic | Thermal interface material Cu–In composite materials Hot press sintering Interface regulation Thermal conductivity |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424029077 |
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