Effect of SiCN passivation on electromigration reliability of nanotwinned Cu redistribution lines
Nanotwinned Cu (NT-Cu), with numerous advantages, is highly suitable for implementation in Cu redistribution lines (RDLs). However, oxidation is a significant reliability concern as it accelerates resistance increase and shortens the electromigration (EM) lifetime of fine-pitch NT-Cu lines. In this...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425009603 |
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