APA (7th ed.) Citation

Hung, Y., La, M., Lin, Y., Tu, K., & Chen, C. Effect of SiCN passivation on electromigration reliability of nanotwinned Cu redistribution lines. Elsevier.

Chicago Style (17th ed.) Citation

Hung, Yu-Wen, Mai-Phuong La, Yi-Quan Lin, K.N Tu, and Chih Chen. Effect of SiCN Passivation on Electromigration Reliability of Nanotwinned Cu Redistribution Lines. Elsevier.

MLA (9th ed.) Citation

Hung, Yu-Wen, et al. Effect of SiCN Passivation on Electromigration Reliability of Nanotwinned Cu Redistribution Lines. Elsevier.