The Microstructure and Thermal Conductivity of Pressureless Infiltrated SiCp/Al Composites Containing Electroless Nickel Platings
A nickel (Ni) coating was deposited on the surface of silicon carbide particles (SiCp) through electroless plating and we characterized the morphology and phase structure of the coating and the pressureless infiltrated SiCp/Al composites. The effect of Ni coatings on the thermal conductivity of the...
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| Format: | Article |
| Language: | English |
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Wiley
2015-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2015/351780 |
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| author | Aihua Zou Xianliang Zhou Xiaozhen Hua Duosheng Li Kaiyang Wu |
| author_facet | Aihua Zou Xianliang Zhou Xiaozhen Hua Duosheng Li Kaiyang Wu |
| author_sort | Aihua Zou |
| collection | DOAJ |
| description | A nickel (Ni) coating was deposited on the surface of silicon carbide particles (SiCp) through electroless plating and we characterized the morphology and phase structure of the coating and the pressureless infiltrated SiCp/Al composites. The effect of Ni coatings on the thermal conductivity of the composites was examined and analyzed with three-dimensional video microscope, scanning electron microscope (SEM), energy-dispersive X-ray spectroscopy (EDS), X-ray diffraction microscope (XRD), and finite-element. The results show that a continuous and uniform coating with a certain thickness (around 3.5 μm) can be formed on the surface of SiCp. With the addition of the Ni layer, there are some intermetallics Ni3Al but no interfacial carbide Al4C3, which improves the wettability and the thermal conductivity of the composites. The experiments and simulations both show that Ni coatings do not substantially decrease the overall thermal conductivity of the composite, although the thermal conductivity of Ni itself is lower than Al and SiC by a factor of 1. |
| format | Article |
| id | doaj-art-12217ba5d51b470291f94defde98bc70 |
| institution | Kabale University |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2015-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-12217ba5d51b470291f94defde98bc702025-02-03T01:02:35ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422015-01-01201510.1155/2015/351780351780The Microstructure and Thermal Conductivity of Pressureless Infiltrated SiCp/Al Composites Containing Electroless Nickel PlatingsAihua Zou0Xianliang Zhou1Xiaozhen Hua2Duosheng Li3Kaiyang Wu4College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaCollege of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, ChinaSchool of Material Science and Engineering, Nanchang Hangkong University, Nanchang 330063, ChinaSchool of Material Science and Engineering, Nanchang Hangkong University, Nanchang 330063, ChinaSchool of Material Science and Engineering, Nanchang Hangkong University, Nanchang 330063, ChinaA nickel (Ni) coating was deposited on the surface of silicon carbide particles (SiCp) through electroless plating and we characterized the morphology and phase structure of the coating and the pressureless infiltrated SiCp/Al composites. The effect of Ni coatings on the thermal conductivity of the composites was examined and analyzed with three-dimensional video microscope, scanning electron microscope (SEM), energy-dispersive X-ray spectroscopy (EDS), X-ray diffraction microscope (XRD), and finite-element. The results show that a continuous and uniform coating with a certain thickness (around 3.5 μm) can be formed on the surface of SiCp. With the addition of the Ni layer, there are some intermetallics Ni3Al but no interfacial carbide Al4C3, which improves the wettability and the thermal conductivity of the composites. The experiments and simulations both show that Ni coatings do not substantially decrease the overall thermal conductivity of the composite, although the thermal conductivity of Ni itself is lower than Al and SiC by a factor of 1.http://dx.doi.org/10.1155/2015/351780 |
| spellingShingle | Aihua Zou Xianliang Zhou Xiaozhen Hua Duosheng Li Kaiyang Wu The Microstructure and Thermal Conductivity of Pressureless Infiltrated SiCp/Al Composites Containing Electroless Nickel Platings Advances in Materials Science and Engineering |
| title | The Microstructure and Thermal Conductivity of Pressureless Infiltrated SiCp/Al Composites Containing Electroless Nickel Platings |
| title_full | The Microstructure and Thermal Conductivity of Pressureless Infiltrated SiCp/Al Composites Containing Electroless Nickel Platings |
| title_fullStr | The Microstructure and Thermal Conductivity of Pressureless Infiltrated SiCp/Al Composites Containing Electroless Nickel Platings |
| title_full_unstemmed | The Microstructure and Thermal Conductivity of Pressureless Infiltrated SiCp/Al Composites Containing Electroless Nickel Platings |
| title_short | The Microstructure and Thermal Conductivity of Pressureless Infiltrated SiCp/Al Composites Containing Electroless Nickel Platings |
| title_sort | microstructure and thermal conductivity of pressureless infiltrated sicp al composites containing electroless nickel platings |
| url | http://dx.doi.org/10.1155/2015/351780 |
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