Tape Automated Bonding for High Density Packaging
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| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
1981-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.8.15 |
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| _version_ | 1832564451226681344 |
|---|---|
| author | Karel Kurzweil |
| author_facet | Karel Kurzweil |
| author_sort | Karel Kurzweil |
| collection | DOAJ |
| format | Article |
| id | doaj-art-121f14bb11074f278c533d9c264d89f0 |
| institution | Kabale University |
| issn | 0882-7516 1563-5031 |
| language | English |
| publishDate | 1981-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Active and Passive Electronic Components |
| spelling | doaj-art-121f14bb11074f278c533d9c264d89f02025-02-03T01:10:57ZengWileyActive and Passive Electronic Components0882-75161563-50311981-01-0181-2151910.1155/APEC.8.15Tape Automated Bonding for High Density PackagingKarel Kurzweilhttp://dx.doi.org/10.1155/APEC.8.15 |
| spellingShingle | Karel Kurzweil Tape Automated Bonding for High Density Packaging Active and Passive Electronic Components |
| title | Tape Automated Bonding for High Density Packaging |
| title_full | Tape Automated Bonding for High Density Packaging |
| title_fullStr | Tape Automated Bonding for High Density Packaging |
| title_full_unstemmed | Tape Automated Bonding for High Density Packaging |
| title_short | Tape Automated Bonding for High Density Packaging |
| title_sort | tape automated bonding for high density packaging |
| url | http://dx.doi.org/10.1155/APEC.8.15 |
| work_keys_str_mv | AT karelkurzweil tapeautomatedbondingforhighdensitypackaging |