Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints
Under the dual impetus of environmental regulations and reliability requirements, the Pb–free/Pb hybrid assembly process in aerospace-grade ball grid array (BGA) components has become an unavoidable industrial imperative. However, constrained process compatibility during single or multiple reflow pr...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-05-01
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| Series: | Crystals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4352/15/6/516 |
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