Effects of High-Density Pulse Currents on the Solidification Structures of Cu-SiCp/AZ91D Composites
In this study, Cu-SiCp/AZ91D composites were prepared with high-density pulse currents. The wettability between SiCp and matrix during solidification was improved by coating 0.095-μm thick copper film on the surface of SiCp. By comparing the composites prepared with/without pulse currents, the solid...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2019-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2019/1684580 |
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