Fluid drawing printing 3D conductive structures for flexible circuit manufacturing
Abstract Three-dimensional (3D) conductive structures significantly reduce flexible circuit complexity and enhance circuit integration. Direct extrusion printing technology offers the advantages of various material applicability and high flexibility for fabricating filamentary interconnects. The pri...
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| Main Authors: | Yikang Li, Dazhi Wang, Yiwen Feng, Xiangji Chen, Xu Chen, Chang Liu, Yanteng Li, Liujia Suo, Ran Zhang, Xiaopeng Zhang, Ben Liu, Fengshu Wang, Shiwen Liang, Lingjie Kong, Qiang Fu, Tongqun Ren, Tiesheng Wang |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2025-05-01
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| Series: | Microsystems & Nanoengineering |
| Online Access: | https://doi.org/10.1038/s41378-025-00936-0 |
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