The current induced mass transformation of Ag alloy wire bonded led chip
The high input and output (I/O) data exchange, coupled with continuous increase in power density, elevates the risk of bonding interface performance degradation and electromigration (EM) failure during electrical transmission. This leads to polarity differences in interconnection structure, undersco...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S223878542500403X |
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