The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films

In this study, we fabricated thin-film resistors using CuMn and yttrium targets by DC/RF magnetron cosputtering. CuMnY-resistive thin films were deposited onto glass and Al2O3 substrates. The electrical properties and microstructures of CuMn alloy films with different yttrium content were investigat...

Full description

Saved in:
Bibliographic Details
Main Authors: Ho-Yun Lee, Chi-Wei He, Ying-Chieh Lee
Format: Article
Language:English
Published: Wiley 2019-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2019/6578350
Tags: Add Tag
No Tags, Be the first to tag this record!
_version_ 1832554773990080512
author Ho-Yun Lee
Chi-Wei He
Ying-Chieh Lee
author_facet Ho-Yun Lee
Chi-Wei He
Ying-Chieh Lee
author_sort Ho-Yun Lee
collection DOAJ
description In this study, we fabricated thin-film resistors using CuMn and yttrium targets by DC/RF magnetron cosputtering. CuMnY-resistive thin films were deposited onto glass and Al2O3 substrates. The electrical properties and microstructures of CuMn alloy films with different yttrium content were investigated. The CuMnY films were annealed at temperature ranging from 250°C to 350°C in N2 atmosphere. The phase variation, microstructure, film thickness, and constitutional analysis of CuMnY films were characterized using X-ray diffraction, field emission scanning, and high-resolution transmission electron microscopy and related energy dispersive X-ray analyses (XRD, FESEM, and HRTEM/EDX). It was found that CuMnY alloy films separated into two parts after annealing. The first part is the MnO phase on the bottom side of the film. The second part is an amorphous structure on the upper side of the film. The MnO phase is a microcrystalline that exists in CuMn films, which is dependent on the Y content and annealing temperature. CuMn alloy films with 15.7% yttrium addition annealed at 300°C exhibited higher resistivity ∼4000 μΩ-cm with −41 ppm/°C of temperature coefficient of resistance (TCR).
format Article
id doaj-art-06de954ddadc4c3cbe8b569f015ee05b
institution Kabale University
issn 1687-8434
1687-8442
language English
publishDate 2019-01-01
publisher Wiley
record_format Article
series Advances in Materials Science and Engineering
spelling doaj-art-06de954ddadc4c3cbe8b569f015ee05b2025-02-03T05:50:34ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422019-01-01201910.1155/2019/65783506578350The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin FilmsHo-Yun Lee0Chi-Wei He1Ying-Chieh Lee2Department of Material Science and Engineering, École Polytechnique Fédérale de Lausanne, Lausanne, SwitzerlandDepartment of Materials Engineering, National Pingtung University of Science & Technology, Pingtung 91201, TaiwanDepartment of Materials Engineering, National Pingtung University of Science & Technology, Pingtung 91201, TaiwanIn this study, we fabricated thin-film resistors using CuMn and yttrium targets by DC/RF magnetron cosputtering. CuMnY-resistive thin films were deposited onto glass and Al2O3 substrates. The electrical properties and microstructures of CuMn alloy films with different yttrium content were investigated. The CuMnY films were annealed at temperature ranging from 250°C to 350°C in N2 atmosphere. The phase variation, microstructure, film thickness, and constitutional analysis of CuMnY films were characterized using X-ray diffraction, field emission scanning, and high-resolution transmission electron microscopy and related energy dispersive X-ray analyses (XRD, FESEM, and HRTEM/EDX). It was found that CuMnY alloy films separated into two parts after annealing. The first part is the MnO phase on the bottom side of the film. The second part is an amorphous structure on the upper side of the film. The MnO phase is a microcrystalline that exists in CuMn films, which is dependent on the Y content and annealing temperature. CuMn alloy films with 15.7% yttrium addition annealed at 300°C exhibited higher resistivity ∼4000 μΩ-cm with −41 ppm/°C of temperature coefficient of resistance (TCR).http://dx.doi.org/10.1155/2019/6578350
spellingShingle Ho-Yun Lee
Chi-Wei He
Ying-Chieh Lee
The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films
Advances in Materials Science and Engineering
title The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films
title_full The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films
title_fullStr The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films
title_full_unstemmed The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films
title_short The Effect of Yttrium Addition on the Microstructures and Electrical Properties of CuMn Alloy Thin Films
title_sort effect of yttrium addition on the microstructures and electrical properties of cumn alloy thin films
url http://dx.doi.org/10.1155/2019/6578350
work_keys_str_mv AT hoyunlee theeffectofyttriumadditiononthemicrostructuresandelectricalpropertiesofcumnalloythinfilms
AT chiweihe theeffectofyttriumadditiononthemicrostructuresandelectricalpropertiesofcumnalloythinfilms
AT yingchiehlee theeffectofyttriumadditiononthemicrostructuresandelectricalpropertiesofcumnalloythinfilms
AT hoyunlee effectofyttriumadditiononthemicrostructuresandelectricalpropertiesofcumnalloythinfilms
AT chiweihe effectofyttriumadditiononthemicrostructuresandelectricalpropertiesofcumnalloythinfilms
AT yingchiehlee effectofyttriumadditiononthemicrostructuresandelectricalpropertiesofcumnalloythinfilms