Fine pitch superconducting interconnects obtained with Nb–Nb direct bonding

Fine pitch superconducting interconnects obtained with Nb–Nb direct bonding

For cryogenic systems, the development of superconducting interconnects is nowadays essential to reach large-scale integration schemes while addressing the associated challenges of signal dispersion and cross talk as well as thermal management. To achieve interconnects with micrometer and potentiall...

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Bibliographic Details
Main Authors: Candice Thomas, Pablo Renaud, Meriem Guergour, Edouard Deschaseaux, Christophe Dubarry, Jennifer Guillaume, Elisa Vermande, Alain Campo, Frank Fournel, Hadi Hijazi, Anne-Marie Papon, Catherine Pellissier, Jean Charbonnier
Format: Article
Language:English
Published: IOP Publishing 2025-01-01
Series:Materials for Quantum Technology
Subjects:
3D integration
superconducting interconnect
direct bonding
low temperature electrical characterizations
Online Access:https://doi.org/10.1088/2633-4356/adaeff
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