Maximally PCB-Space-Saving Hybrid Integration of Millimeter-Wave and Microwave Antennas for 5G and B5G Smartphones
This paper proposes a simple, low-cost, and practical hybrid integration design of a 5G FR2 millimeter-wave antenna module based on a thin flexible printed circuit (FPC) and a 5G FR1 microwave antenna based on a metal frame to maximally save precious printed circuit board (PCB) space for more compet...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10858119/ |
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