Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices
Abstract The demand for flexible and printed electronics in wearable and soft robotics applications has increased the need for scalable, additive manufacturing processes. However, traditional printed circuit board manufacturing involves complex, multistep processes, is limited to certain substrates,...
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| Format: | Article |
| Language: | English |
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Wiley
2025-05-01
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| Series: | Advanced Science |
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| Online Access: | https://doi.org/10.1002/advs.202415272 |
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| author | Wedyan Babatain Christine Park Hiroshi Ishii Neil Gershenfeld |
| author_facet | Wedyan Babatain Christine Park Hiroshi Ishii Neil Gershenfeld |
| author_sort | Wedyan Babatain |
| collection | DOAJ |
| description | Abstract The demand for flexible and printed electronics in wearable and soft robotics applications has increased the need for scalable, additive manufacturing processes. However, traditional printed circuit board manufacturing involves complex, multistep processes, is limited to certain substrates, and faces challenges in integrating functional devices. Here, an additive, laser‐enabled process is introduced for fabricating flexible, double‐sided printed electronics leveraging laser‐induced graphene (LIG) as a seed layer for selective copper electrodeposition (E‐LIG). This technique enables precise conductive circuit patterning down to 50 µm and is reliable via formation in a single streamlined process. E‐LIG supports transfer to various substrates, allowing for large‐area electronics up to 100 cm2, broadening applications in large‐scale interfaces. Functional LIG device integration, including sensors and actuators, directly interfaced with control circuits on a single substrate is demonstrated. Applications such as real‐time graphical output and interactive interfacing showcase the method's versatility. E‐LIG exhibits repairability for on‐demand restoration of damaged circuits, enhancing durability and offering a scalable, cost‐effective solution for multifunctional printed electronics. |
| format | Article |
| id | doaj-art-059678847711420986206646231dc255 |
| institution | OA Journals |
| issn | 2198-3844 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advanced Science |
| spelling | doaj-art-059678847711420986206646231dc2552025-08-20T02:34:43ZengWileyAdvanced Science2198-38442025-05-011220n/an/a10.1002/advs.202415272Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional DevicesWedyan Babatain0Christine Park1Hiroshi Ishii2Neil Gershenfeld3Media Lab Massachusetts Institute of Technology Cambridge MA 02139 USAMedia Lab Massachusetts Institute of Technology Cambridge MA 02139 USAMedia Lab Massachusetts Institute of Technology Cambridge MA 02139 USACenter for Bits and Atoms Massachusetts Institute of Technology Cambridge MA 02139 USAAbstract The demand for flexible and printed electronics in wearable and soft robotics applications has increased the need for scalable, additive manufacturing processes. However, traditional printed circuit board manufacturing involves complex, multistep processes, is limited to certain substrates, and faces challenges in integrating functional devices. Here, an additive, laser‐enabled process is introduced for fabricating flexible, double‐sided printed electronics leveraging laser‐induced graphene (LIG) as a seed layer for selective copper electrodeposition (E‐LIG). This technique enables precise conductive circuit patterning down to 50 µm and is reliable via formation in a single streamlined process. E‐LIG supports transfer to various substrates, allowing for large‐area electronics up to 100 cm2, broadening applications in large‐scale interfaces. Functional LIG device integration, including sensors and actuators, directly interfaced with control circuits on a single substrate is demonstrated. Applications such as real‐time graphical output and interactive interfacing showcase the method's versatility. E‐LIG exhibits repairability for on‐demand restoration of damaged circuits, enhancing durability and offering a scalable, cost‐effective solution for multifunctional printed electronics.https://doi.org/10.1002/advs.202415272additive manufacturingdigital fabricationflexible electronicslaser writingprinted electronics |
| spellingShingle | Wedyan Babatain Christine Park Hiroshi Ishii Neil Gershenfeld Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices Advanced Science additive manufacturing digital fabrication flexible electronics laser writing printed electronics |
| title | Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices |
| title_full | Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices |
| title_fullStr | Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices |
| title_full_unstemmed | Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices |
| title_short | Laser‐Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices |
| title_sort | laser enabled fabrication of flexible printed electronics with integrated functional devices |
| topic | additive manufacturing digital fabrication flexible electronics laser writing printed electronics |
| url | https://doi.org/10.1002/advs.202415272 |
| work_keys_str_mv | AT wedyanbabatain laserenabledfabricationofflexibleprintedelectronicswithintegratedfunctionaldevices AT christinepark laserenabledfabricationofflexibleprintedelectronicswithintegratedfunctionaldevices AT hiroshiishii laserenabledfabricationofflexibleprintedelectronicswithintegratedfunctionaldevices AT neilgershenfeld laserenabledfabricationofflexibleprintedelectronicswithintegratedfunctionaldevices |