APA (7th ed.) Citation

Jie, Y., Guang-xu, L., Jing, Z., Wen-ying, W., Xiao-feng, W., & Jin-wen, Z. Microstructure and failure mechanism of FGH96 solid-state diffusion bonding interface. Editorial Office of Powder Metallurgy Technology.

Chicago Style (17th ed.) Citation

Jie, YANG, LIU Guang-xu, ZHANG Jing, WANG Wen-ying, WANG Xiao-feng, and ZOU Jin-wen. Microstructure and Failure Mechanism of FGH96 Solid-state Diffusion Bonding Interface. Editorial Office of Powder Metallurgy Technology.

MLA (9th ed.) Citation

Jie, YANG, et al. Microstructure and Failure Mechanism of FGH96 Solid-state Diffusion Bonding Interface. Editorial Office of Powder Metallurgy Technology.