Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders
TLPS (Transient Liquid Phase Sintering) process is a candidate method of heat-resistant bonding, which makes use of the reaction between low-melting temperature powder of Sn-Bi base alloys and reactive powder of Ag. During heat treatment above the melting temperature of a Sn-Bi base alloy, the m...
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University of Belgrade, Technical Faculty, Bor
2012-01-01
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| Series: | Journal of Mining and Metallurgy. Section B: Metallurgy |
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| Online Access: | http://www.doiserbia.nb.rs/img/doi/1450-5339/2012/1450-53391200052O.pdf |
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| author | Ohnuma I. Kainuma R. Ishida K. |
| author_facet | Ohnuma I. Kainuma R. Ishida K. |
| author_sort | Ohnuma I. |
| collection | DOAJ |
| description | TLPS (Transient Liquid Phase Sintering) process is a candidate method of heat-resistant bonding, which makes use of the reaction between low-melting temperature powder of Sn-Bi base alloys and reactive powder of Ag. During heat treatment above the melting temperature of a Sn-Bi base alloy, the molten Sn-Bi reacts rapidly with solid Ag particles, which results in the formation of heat-resistant intermetallic compound (IMC). In this study, the TLPS properties between Sn-17Bi-1Ag (at.%) powder with its liquidus temperature of 200°C and pure Ag powder were investigated. During differential scanning calorimetry (DSC) measurement, an exothermic reaction and an endothermic reaction occurred, which correspond to the formation of the e-Ag3Sn IMC phase and the melting of the Sn-17Bi-1Ag alloy, respectively. After the overall measurement, the obtained reactant consists of the Ag3Sn-IMC and Bi-rich phases, both of which start melting above 250°C, with a small amount of the residual Sn-Bi eutectic phase. These results suggest that the TLPS process can be applied for Pb-free heatresistant bonding. |
| format | Article |
| id | doaj-art-00ffa2d253794849a33d91159f8bda95 |
| institution | Kabale University |
| issn | 1450-5339 |
| language | English |
| publishDate | 2012-01-01 |
| publisher | University of Belgrade, Technical Faculty, Bor |
| record_format | Article |
| series | Journal of Mining and Metallurgy. Section B: Metallurgy |
| spelling | doaj-art-00ffa2d253794849a33d91159f8bda952025-02-02T07:03:45ZengUniversity of Belgrade, Technical Faculty, BorJournal of Mining and Metallurgy. Section B: Metallurgy1450-53392012-01-0148341341810.2298/JMMB121123052ODevelopment of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powdersOhnuma I.Kainuma R.Ishida K.TLPS (Transient Liquid Phase Sintering) process is a candidate method of heat-resistant bonding, which makes use of the reaction between low-melting temperature powder of Sn-Bi base alloys and reactive powder of Ag. During heat treatment above the melting temperature of a Sn-Bi base alloy, the molten Sn-Bi reacts rapidly with solid Ag particles, which results in the formation of heat-resistant intermetallic compound (IMC). In this study, the TLPS properties between Sn-17Bi-1Ag (at.%) powder with its liquidus temperature of 200°C and pure Ag powder were investigated. During differential scanning calorimetry (DSC) measurement, an exothermic reaction and an endothermic reaction occurred, which correspond to the formation of the e-Ag3Sn IMC phase and the melting of the Sn-17Bi-1Ag alloy, respectively. After the overall measurement, the obtained reactant consists of the Ag3Sn-IMC and Bi-rich phases, both of which start melting above 250°C, with a small amount of the residual Sn-Bi eutectic phase. These results suggest that the TLPS process can be applied for Pb-free heatresistant bonding.http://www.doiserbia.nb.rs/img/doi/1450-5339/2012/1450-53391200052O.pdfTransient Liquid Phase Sintering (TLPS)CALPHADhigh-tepmerature Pb-free solder |
| spellingShingle | Ohnuma I. Kainuma R. Ishida K. Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders Journal of Mining and Metallurgy. Section B: Metallurgy Transient Liquid Phase Sintering (TLPS) CALPHAD high-tepmerature Pb-free solder |
| title | Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders |
| title_full | Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders |
| title_fullStr | Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders |
| title_full_unstemmed | Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders |
| title_short | Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders |
| title_sort | development of heat resistant pb free joints by tlps process of ag and sn bi ag alloy powders |
| topic | Transient Liquid Phase Sintering (TLPS) CALPHAD high-tepmerature Pb-free solder |
| url | http://www.doiserbia.nb.rs/img/doi/1450-5339/2012/1450-53391200052O.pdf |
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