Analysis of High Tc Superconducting Rectangular Microstrip Patches over Ground Planes with Rectangular Apertures in Substrates Containing Anisotropic Materials

Analysis of High Tc Superconducting Rectangular Microstrip Patches over Ground Planes with Rectangular Apertures in Substrates Containing Anisotropic Materials

A rigorous full-wave analysis of high Tc superconducting rectangular microstrip patch over ground plane with rectangular aperture in the case where the patch is printed on a uniaxially anisotropic substrate material is presented. The dyadic Green’s functions of the considered structure are efficient...

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Bibliographic Details
Main Authors: Abderraouf Messai, Siham Benkouda, Mounir Amir, Sami Bedra, Tarek Fortaki
Format: Article
Language:English
Published: Wiley 2013-01-01
Series:International Journal of Antennas and Propagation
Online Access:http://dx.doi.org/10.1155/2013/169893
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