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    Recent Developments in Thermal Management of 3D ICs: A Review

    Recent Developments in Thermal Management of 3D ICs: A Review by Fen Guo, Zhao-Jun Suo, Xin Xi, Yu Bi, Tuo Li, Changhong Wang, Kang Su, Xiaofeng Zou, Rengang Li

    Published 2025-01-01
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