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Research Progress on Insulated Gate Bipolar Transistor (IGBT) Modules by Peisheng Liu, Yaohui Deng
Published 2025-02-01Get full text
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Thermal stress behavior and optimization of solder joints in CSP-LED packages by Jinlan Wang, Yaohui Deng, Zhao Zhang, Jiajie Jin, Peisheng Liu
Published 2025-06-01Get full text
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3
3D package thermal analysis and thermal optimization by Yaohui Deng, Peisheng Liu, Zhao Zhang, Jiajie Jin, Pengpeng Xu, Lei Yan
Published 2024-12-01Get full text
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