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    Wafer-scale platform for on-chip 3D radio frequency lumped passive components using metal self-rolled-up membrane technique

    Wafer-scale platform for on-chip 3D radio frequency lumped passive components using metal self-rolled-up membrane technique by Zhikun Zhou, Zihan Zhang, Hanlin Zhang, Xianchao Wei, Wei He, Quhuan Shen, Xiuwen Bi, Tao Yuan, Xiaochen Chen, Lei Sang, Wen Huang

    Published 2025-03-01
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