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    Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition

    Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition by Xiangxia Kong, Zuchen Liu, Ruipeng Ma, Junjun Zhai, Zhen Pan, Xuemei Li, Fenglian Sun

    Published 2024-12-01
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