The Deformation of a Liquid Metal Droplet Under Continuous Acceleration in a Variable Cross-Section Groove by Hanyang Xu, Haojie Dang, Wenchao Tian, Zhao Li

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Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration by Wenchao Tian, Feiyang Li, Mang He, Haoyue Ji, Si Chen

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Cam Design and Pin Defect Detection of Cam Pin Insertion Machine in IGBT Packaging by Wenchao Tian, Pengchao Zhang, Mingfang Tian, Si Chen, Haoyue Ji, Bingxu Ma

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Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging by Wenchao Tian, Dexin Li, Haojie Dang, Shiqian Liang, Yizheng Zhang, Xiaojun Zhang, Si Chen, Xiaochuan Yu

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Damage Mechanism Analysis of High Field Stress on Cascode GaN HEMT Power Devices by Shuo Su, Yanrong Cao, Weiwei Zhang, Xinxiang Zhang, Chuan Chen, Linshan Wu, Zhixian Zhang, Miaofen Li, Ling Lv, Xuefeng Zheng, Wenchao Tian, Xiaohua Ma, Yue Hao

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