Progress and prospect of packaging of high-power semiconductor modules by WANG Yangang, LUO Haihui, XIAO Qiang

Get full text

Packaging Consideration and Development for Fully Sintered SiC Power Module by DAI Xiaoping, WU Yibo, ZHAO Yimin, WANG Yangang

Get full text

The Mechanism, Calculation and Simulation of Power Loss for IGBT Modules by WANG Yangang, DAI Xiaoping, WU Yibo, JONES Steve, LIU Guoyou

Get full text

Clinical effect of Jinhu Gushen prescription in reducing urinary protein and blood uric acid in patients with diabetic kidney disease by LI Yixuan, HUANG Yajing, WEI Fanxiang, LI Wenxuan, XU Lili, WANG Yangang

Get full text

Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle by WANG Yangang, LIU Xuyu, DAI Xiaoping, WU Yibo, PENG Yongdian, LIU Guoyou

Get full text