An interpretable stacking ensemble model for high-entropy alloy mechanical property prediction by Songpeng Zhao, Zeyuan Li, Changshuai Yin, Zhaofu Zhang, Teng Long, Jingjing Yang, Ruyue Cao, Yuzheng Guo

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Investigation of grain growth mechanisms in nanocrystalline Cu for Cu direct bonding by Shichen Xie, Ziting Ye, Zishan Xiong, Fuxin Du, Songpeng Zhao, K.N. Tu, Yuzheng Guo, Sheng Liu, Yingxia Liu

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