The study on low temperature reflow of antioxidant multicomponent solder paste on copper substrates by Xingchao Mao, Qinglei Sun, Jingyu Qiao, Yulong Chen, Lulin Xie, Shichen Xie, Yongmao Yang, King-Ning Tu, Yingxia Liu

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Investigation of grain growth mechanisms in nanocrystalline Cu for Cu direct bonding by Shichen Xie, Ziting Ye, Zishan Xiong, Fuxin Du, Songpeng Zhao, K.N. Tu, Yuzheng Guo, Sheng Liu, Yingxia Liu

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New insights into developmental biology of Eimeria tenella revealed by comparative analysis of mRNA N6-methyladenosine modification between unsporulated oocysts and sporulated oocy... by Qing Liu, Bingjin Mu, Yijing Meng, Linmei Yu, Zirui Wang, Tao Jia, Wenbin Zheng, Wenwei Gao, Shichen Xie, Xingquan Zhu

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