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    High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions

    High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions by Shenggao Li, Mu-Shan Lin, Wei-Chih Chen, Chien-Chun Tsai

    Published 2024-01-01
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