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    Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers

    Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers by Detlef Billep, Jan Mehner, Alexey Shaporin, Klaus Vogel, Dirk Wuensch, Maik Wiemer

    Published 2011-01-01
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