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    Electromigration-induced failure mode of low-temperature Sn–49Bi–1Ag hybrid BGA joint in flip chip package

    Electromigration-induced failure mode of low-temperature Sn–49Bi–1Ag hybrid BGA joint in flip chip package by J. Ren, F.F. Huang, A.J. Li, M.L. Huang

    Published 2025-05-01
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