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  1. 1
    Study on the Stress and Warpage of Flip Chip Package Under Current Crowding

    Study on the Stress and Warpage of Flip Chip Package Under Current Crowding by SHE Chenhui; YANG Longlong; TAN Lipeng; LIU Peisheng

    Published 2020-12-01
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  2. 2
    Compressive strength and specific strength of porous nickel foam/resin composite material

    Compressive strength and specific strength of porous nickel foam/resin composite material by LIU Peisheng, CHENG Yuyang, CHENG Wei, CHEN Bin, LI Xiangyu

    Published 2025-03-01
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