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    Board level BGA and CSP Underfill – diagnostic methods and the potential of using a tensile test and subsequent optical microscopy

    Board level BGA and CSP Underfill – diagnostic methods and the potential of using a tensile test and subsequent optical microscopy by Zbyněk Plachý, Anna Pražanová, Attila Géczy, Karel Dušek

    Published 2025-08-01
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  2. 2
    Vapour phase reflow soldering with vertical assembly stacking to improve productivity

    Vapour phase reflow soldering with vertical assembly stacking to improve productivity by Gergő Havellant, Balázs Illés, Patrik Kovács, David Bušek, Karel Dušek, Attila Géczy

    Published 2025-03-01
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