Electromigration failure induced by interdiffusion between Al trace and Cu seed layer in the immortal microbump in three-dimensional integrated circuit by Yifan Yao, Yuxuan An, K.N. Tu, Yingxia Liu

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Effect of SiCN passivation on electromigration reliability of nanotwinned Cu redistribution lines by Yu-Wen Hung, Mai-Phuong La, Yi-Quan Lin, K.N. Tu, Chih Chen

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Investigation of grain growth mechanisms in nanocrystalline Cu for Cu direct bonding by Shichen Xie, Ziting Ye, Zishan Xiong, Fuxin Du, Songpeng Zhao, K.N. Tu, Yuzheng Guo, Sheng Liu, Yingxia Liu

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