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    Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data by Jinhua Mi, Yan-Feng Li, Yuan-Jian Yang, Weiwen Peng, Hong-Zhong Huang

    Published 2014-01-01
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