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  1. 1
    Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology

    Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology by Junhao Du, Xuewei Zhao, Jiale Su, Ben Li, Xiangliang Duan, Tianyu Dong, Hongxiao Lin, Yuhui Ren, Yuanhao Miao, Henry H. Radamson

    Published 2025-01-01
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  2. 2
    Spin‐coating fabrication of high‐yield and uniform organic thin‐film transistors via a primer template growth

    Spin‐coating fabrication of high‐yield and uniform organic thin‐film transistors via a primer template growth by Zhenxin Yang, Jiale Su, Junzhan Wang, Xuanhe Li, Fushun Li, Juntao Hu, Nan Chen, Zhang Tao, Delong Yang, Deng‐Ke Wang, Qiang Zhu, Yuhui Liao, Zheng‐Hong Lu

    Published 2025-01-01
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