Characterization and Failure Analysis of Solder Joints in Ball Grid Array (BGA) Components Using Cross-Section, Dye and Pry, and Microstructural Etching Techniques by G.F.R.C. Pádua, L.F.S. Figueiredo, G.S. Rocha, J.S.M. Junior, J.S. de Oliveira, R.S. Barboza, A.C. Kieling, J.C. Macêdo Neto

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