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Humidity Sensing in Graphene-Trenched Silicon Junctions via Schottky Barrier Modulation by Akeel Qadir, Munir Ali, Afshan Khaliq, Shahid Karim, Umar Farooq, Hongsheng Xu, Yiting Yu

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Microstructural evolution and mechanical properties of chip-stacking micro-solder joints under TG bonding process by Ye Tian, Hongsheng Xu, Yuejun Li, Zhongyu Liu, Daoming Fan, Chao Wang, Ziqiang Li, Wei Liu, Xing Chen, Fengshun Wu

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