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    Heterogeneous integration approach based on flip-chip bonding and misalignment self-correction elements for electronics-optics integration applications

    Heterogeneous integration approach based on flip-chip bonding and misalignment self-correction elements for electronics-optics integration applications by Bui Thanh Tung, Motohiro Suzuki, Fumiki Kato, Shunsuke Nemoto, Masahiro Aoyagi

    Published 2012-11-01
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