Showing 1 - 2 results of 2 for search 'FENG Huiyu', query time: 0.01s Refine Results
  1. 1
    Study of the Package Degradation of IGBT Module during Thermal Cycling Test

    Study of the Package Degradation of IGBT Module during Thermal Cycling Test by XU Ninghua, PENG Yongdian, LUO Haihui, FENG Huiyu, LI Liangxing, LI Han

    Published 2016-01-01
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  2. 2
    Application of Acoustic Scanning Technology in Quality Analysis of IGBT Module

    Application of Acoustic Scanning Technology in Quality Analysis of IGBT Module by LI Han, ZENG Xiong, XU Ninghua, HE Xinqiang, FENG Huiyu, LI Liangxing

    Published 2016-01-01
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