Study on influence of solder voids on power cycling lifetime of IGBT module by LIU Peng, DENG Erping, ZHOU Wangjun, CHEN Jie, HUANG Yongzhang

Get full text

Research on the influence of epoxy resin on the service life of bond wire in power devices by HUA Wenbo, DENG Erping, LIU Peng, NIU Hao, YANG Shaohua, DING Lijian

Get full text

Research on deconvolution methods for thermal network of power devices by DENG Erping, YANG Ying, WANG Yanhao, CHANG Guiqin, HUANG Yongzhang, DING Lijian

Get full text