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  1. 1
    Interfacial reaction and thermomigration of copper/indium joints

    Interfacial reaction and thermomigration of copper/indium joints by Zi-Yu Huang, Yen-Ju Chu, Cheng-En Ho, Yu-An Shen, Chih-Ming Chen

    Published 2025-01-01
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  2. 2
    Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses

    Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses by Pei-Chia Hsu, Zhao-Yu Yang, Chi Lee, Cheng-En Ho, Chih-Ming Chen, Yu-An Shen

    Published 2025-05-01
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